SMT REWORK SIMPLIFIED
BGA REBALLING
Our ReBall System is elegant in design and easy to use. Designed to save you both time and money, it's no wonder that it's the most popular reballing system in use. The anodized frames and base are fully reusable. For each component we provide custom designed foil sets for print and ball placement as well as a drop in aluminum part nest and print squeegee.
PRINT ON PART
Our PrintPart system works with most automated rework systems. Since the aluminum parts are reusable, different components only require additional foil sets making this easy to order and economical. Designed primarily for printing solderpaste onto the balls or bumps on BGA's down to .5mm pitch. A favorite with OEM labs and a must for rework on leadless devices QFN's and LGA's.
MINI STENCILS
Our most popular rework product. Custom made to your specifications. Ministencils remain the most used rework tool for localized component rework. They allow consistent paste print in tight areas and are available in three formats to suit your technician's preference. Simple, inexpensive, and shipped the next day.
REFLOW NOZZLES
Our ReBall System is elegant in design and easy to use. Designed to save you both time and money, it's no wonder that it's the most popular reballing system in use. The anodized frames and base are fully reusable. For each component we provide custom designed foil sets for print and ball placement as well as a drop in aluminum part nest and print squeegee.
PRESSFIT DIES
Our PrintPart system works with most automated rework systems. Since the aluminum parts are reusable, different components only require additional foil sets making this easy to order and economical. Designed primarily for printing solderpaste onto the balls or bumps on BGA's down to .5mm pitch. A favorite with OEM labs and a must for rework on leadless devices QFN's and LGA's.
