BGA REBALLING
Our ReBall System is elegant in design and easy to use. Designed to save you both time and money, it's no wonder that it's the most popular reballing system in use. The anodized frames and base are fully reusable. For each component we provide custom designed foil sets for print and ball placement as well as a drop in aluminum part nest and print squeegee.
PRINT ON PART
Our PrintPart system works with most automated rework systems. Since the aluminum parts are reusable, different components only require additional foil sets making this easy to order and economical. Designed primarily for printing solderpaste onto the balls or bumps on BGA's down to .5mm pitch. A favorite with OEM labs and a must for rework on leadless devices QFN's and LGA's.
MINI STENCILS
Our most popular rework product. Custom made to your specification. Ministencils remain the most used rework tool for localized component rework. They allow consistent and repeatable solder paste printing in tight areas down to 5mm x 5mm without disturbing surrounding parts. Our mini stencils are available in three formats to suit your preference. Simple, inexpensive, and shipped the next day.
REFLOW NOZZLES
Compatible with the most common rework systems, our nozzles are manufactured only to the size that you specify! Rigid, all steel construction, with bottom vents to ensure even heat distribution and diverter flaps to protect nearby parts. Our nozzles can be manufactured and shipped in as little as two days ! Ordering is as simple as telling us the rectangular width and length of the opening you need.
PRESSFIT DIES
Beam On’s pressfit dies are a smarter alternative to OEM provided or EDM manufactured dies. They are not only a fraction of the cost, but can be manufactured and shipped within a week. Our two part system is comprised of an easy to machine aluminum block and a stainless steel face plate that acts as a bearing surface for the individual pin shoulders preventing component body damage.
