Mini-Stencils
Mini-stencils are small stencils used mainly for BGA rework. They are designed so that precise amounts of solderpaste can be applied to single BGA footprints on populated assemblies.
Our mini-stencil design is flexible enough to operate with a dedicated BGA rework systems as well as for use in manual printing.
Our ministencils have been designed for optimum stability and flatness. We use side reinforcements to prevent side to side shift and front ramps to prevent solder paste spillage.
All of our ministencils are provided with custom squeegee blades fabricated to precisely fit the particular mini-stencil.
Other uses for mini-stencils include IC and QFP rework, Heatsink Epoxy Application, Short Runs for Small Prototypes, Flux Application, and 2nd Assembly Thru-hole Reflow.
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