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Dogbone Opening: A
modification that can be applied in two different
situations. For fine pitch it reduces solder in the
middle of the pad to reduce bridging but gives more
volume on the ends for good fillets. It can also be used
when reflowing double side SMT Connectors. |
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Homebase Openings:
The most common shape used when trying to keep paste away
from the component body in order to eliminate solderballs
when using a no-clean solderpaste. |
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StepDown /
Multilevel: The only cost/time effective method of
printing different paste heights using the same stencil.
Commonly used when dealing with CCGA's to prevent
coplanarity issues. |
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Epoxy Design: A service which has been provided and perfected since Beam On's inception. Stencil openings are designed to deposit just the right amount of glue to hold the components
during wave solder process. |
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Thru-Hole Reflow: Also called "Pin-In-Paste," stencil openings are designed for thru-hole assembly during reflow instead of wave solder. At Beam On we have the ability to incorporate this design with EtchDowns when large amounts of solder are required. For the intrepid, ask us about double stencil process for PTH reflow. |
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Square: It's a
square, so what? It's also the best shape to use when
printing very small openings for MicroBGA's to optimize
paste deposition. |
|
Backetch: Used to
relieve for surface features that prevent the stencil
from making adequate contact with the board such as
barcode labels, tented vias, wire ink, etc. Also used for
Dual Stencil Processes. |
|
Trapezoidal Walls:
All stencils manufactured by Beam On, and to be honest,
almost every other stencil company, have openings that
are larger on the contact side than the squeegee side to
enhance paste release. |
